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On 16 September 2026, just before SEMICON India 2026, Japan's Fujifilm announced a greenfield semiconductor materials plant in India worth about ₹800 crore (~US$83 million).
Phase 1 will make front-end process chemicals, with investment starting in October 2026 and commercial production in FY2028. Phase 2 will add surface-conditioning materials and high-purity chemicals, timed to demand.
The project is aligned with India Semiconductor Mission (ISM) 2.0, which the Union Cabinet approved in July 2026.
Second phase of India's chip-manufacturing push, approved by the Cabinet on 15 July 2026 (about US$13 billion)
Key: Programme life extended from 5 to 12 years; a flat 30% incentive for manufacturing semiconductor equipment, chemicals, gases and materials, the category Fujifilm's plant falls in
Semicon India Programme approved in December 2021
Key: ₹76,000 crore outlay for fabs, ATMP/OSAT, display fabs and design-linked incentives
Nodal agency for semiconductor and display manufacturing incentives
Japanese multinational in imaging, healthcare and advanced materials, including electronic materials for chipmaking
Chips are made with ultra-pure chemicals, gases and slurries. Front-end process chemicals are used during wafer fabrication, and surface-conditioning materials clean and prepare wafer surfaces. Sourcing them locally cuts import dependence and delays for fabs.
Simple Analogy: Like a bakery that needs a flour mill nearby, not just ovens.
GS Paper III > Industrial policy; Science & Technology
General Awareness > Business & Economy
A new facility built from scratch, as opposed to expanding or acquiring an existing one (brownfield)
Wafer-level fabrication steps in chipmaking, before assembly and packaging
Chemicals with ultra-low contamination, needed because tiny impurities ruin chips