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On 16 September 2026, US-based chip equipment maker Lam Research announced an investment of about ₹10,000 crore in India over several years.
The plan includes Lam's first silicon component manufacturing facility in India, covering silicon ingot production and processing for leading-edge chip nodes and serving as an export base.
It also expands R&D at Lam's India Center for Engineering in Bengaluru. With IISc and the India Semiconductor Mission, Lam aims to train up to 60,000 students on its Semiverse Solutions virtual platform.
Global supplier of wafer fabrication equipment (etch, deposition) and services
Training partner for the Semiverse-based semiconductor skilling programme
Government nodal agency for semiconductor incentives and skilling partnerships
Build out the chip value chain: fabs, packaging, design, and equipment and material suppliers
Key: Approved 15 July 2026; lifecycle extended to 12 years; flat 30% incentive for equipment, chemicals, gases and materials
Ultra-pure silicon is grown into a single-crystal cylinder called an ingot, which is sliced into thin wafers on which chips are made. Lam's plant will make silicon components used inside chipmaking tools, a specialised upstream step.
Simple Analogy: Like baking the loaf before slicing the bread.
GS Paper III > Science & Technology; Industrial policy
General Awareness > Business
Tools that deposit, etch and clean layers on silicon wafers in a fab
The most advanced chip process technology, with the smallest features
One firm handling several successive stages of production