South Korean memory chipmaker SK Hynix approved a 54.3 trillion won investment, about $38.15 billion, on 7 August 2026.
The money funds two new semiconductor fabrication plants — the Yongin 'Y2' fab in Gyeonggi Province and the Cheongju 'M17' fab in North Chungcheong Province.
Yongin Y2 receives 35.2 trillion won and will produce DRAM for high-bandwidth memory; Cheongju M17 receives 19.1 trillion won for NAND and enterprise SSDs.
The Yongin facility is scheduled to break ground in July 2027, with its first cleanroom targeted for June 2029.
Omdia projected global DRAM and NAND demand growth at a compound annual rate of 19% through 2030.
DRAM is fast, volatile working memory — it holds data a processor is actively using and loses it when power is cut. NAND flash is non-volatile storage, retaining data without power, and is what solid-state drives, USB drives and memory cards are built from. High-bandwidth memory, or HBM, is a stacked DRAM architecture that places memory dies vertically and connects them with very wide data paths, delivering high bandwidth at low latency. AI accelerators and graphics processors depend on it because their bottleneck is usually not raw computing power but how fast data can be fed to the processor.
Simple Analogy: If the processor is a chef, DRAM is the countertop and NAND is the pantry. HBM widens the doorway between them so ingredients arrive faster than the chef can chop.
General Awareness > Science, technology and international business
General Awareness > Global industry, investment and technology trends
General Awareness > Science and technology
A facility where integrated circuits are manufactured on silicon wafers using cleanrooms, lithography, deposition, etching and testing equipment.
A stacked DRAM architecture providing high bandwidth and low latency, used in AI accelerators and graphics processors.
Non-volatile memory that retains data without power, used in solid-state drives, USB drives and memory cards.
A controlled environment used in semiconductor manufacturing to limit dust and contamination that would ruin chips.