Union Minister of Commerce and Industry Piyush Goyal concluded an official visit to Japan covering Tokyo, Nagoya and Osaka, engaging the leadership of more than 30 major Japanese companies and financial institutions.
At a Semiconductor and AI Roundtable he set out India's six-pillar semiconductor strategy - chip design, semiconductor machinery and materials, fabrication, ATMP/OSAT, research and development, and talent development - against projected Indian semiconductor demand of USD 150 billion by 2032.
The visit advanced the target of JPY 10 trillion in Japanese private investment in India over the next decade, agreed during Prime Minister Narendra Modi's visit to Japan in 2025.
Goyal met Japan's Minister of Economy, Trade and Industry Akazawa Ryosei and senior representatives of JETRO, JBIC and JICA, and addressed Keidanren, which represents more than 1,500 leading Japanese companies.
A 'India-Japan Next Generation Economic Partnership' roadshow in Nagoya, organised with Chukeiren, drew more than 80 Japanese companies from the Chubu region across automobiles, aerospace, machine tools, semiconductors and auto components.
Build a domestic semiconductor and display manufacturing ecosystem covering fabrication, packaging and design.
Key: Launched in 2021 with a financial outlay of Rs 76,000 crore under the Ministry of Electronics and Information Technology, with fiscal support of up to 50 per cent of project cost for silicon fabs, display fabs, compound semiconductor and sensor fabs, ATMP/OSAT packaging units and chip design. The India Semiconductor Mission is the nodal agency that administers it. As of December 2025, ten projects with total investment of about Rs 1.60 lakh crore had been approved across six states, including Micron's assembly and test plant at Sanand, the Tata Electronics fab at Dholera with Powerchip Semiconductor Manufacturing Corporation of Taiwan, and the CG Power-Renesas unit at Sanand.
Extend long-term policy support to the semiconductor ecosystem beyond the first phase, across the full value chain.
Key: Approved by the Union Cabinet on 15 July 2026 with a total outlay of Rs 1,27,500 crore. It is designed around the same six pillars the Minister set out in Tokyo - chip design, manufacturing equipment and materials, fabrication, packaging, research and development, and talent development.
Attract large investment in mobile phone manufacturing and specified electronic components through incentives paid on incremental sales of goods made in India.
Key: Approved in 2020 with a total cost of about Rs 40,995 crore, of which about Rs 40,951 crore is the incentive outlay. It was among the first PLI schemes, alongside pharmaceuticals and medical devices; the Union Budget 2021-22 extended the PLI approach across 13 key sectors with an announced outlay of about Rs 1.97 lakh crore. Its coverage of ATMP units links it directly to the semiconductor packaging pillar.
Liberalise bilateral trade in goods and services and provide an institutional framework for investment.
Key: Signed in Tokyo on 16 February 2011 and in force from 1 August 2011. It covers trade in goods, services, movement of natural persons, investment, intellectual property rights and customs procedures, and envisages the abolition of tariffs on over 94 per cent of traded items over a ten-year period.
Government-funded body that promotes trade and investment between Japan and the rest of the world, and supports Japanese firms setting up abroad. Established in 1958; it runs a global network of offices, including in India.
Japan's policy-based financial institution and export credit agency, financing overseas projects and resource security. Created on 1 October 1999 through the merger of the Japan Export-Import Bank and the Overseas Economic Cooperation Fund.
Japan's official development assistance agency and one of the world's largest bilateral aid agencies; the lender behind major Indian infrastructure projects. Established in its present incorporated administrative agency form on 1 August 2003.
Japan's apex business lobby, representing more than 1,500 leading Japanese companies; the release records the Minister's interaction with it. Founded in August 1946 during Japan's post-war reconstruction.
Japan's ministry for industrial and trade policy, and the counterpart of India's Ministry of Commerce and Industry in these discussions. Represented by Minister Akazawa Ryosei.
| Aspect | JETRO | JBIC | JICA |
|---|---|---|---|
| What it is | Trade and investment promotion organisation | Policy-based financial institution and export credit agency | Official development assistance agency |
| Established | 1958 | 1 October 1999 | 1 August 2003 in its present form |
| Formed from | A government-funded trade promotion body | Merger of the Japan Export-Import Bank and the Overseas Economic Cooperation Fund | Consolidation of Japan's technical cooperation and ODA loan functions |
| Core function | Helps firms find markets and partners; publishes trade and investment intelligence | Lends for overseas projects, resource security and export finance | Delivers grants, technical cooperation and concessional ODA loans |
| Headquarters | Tokyo | Tokyo | Tokyo |
India-Japan Comprehensive Economic Partnership Agreement signed in Tokyo.
CEPA enters into force, covering goods, services, movement of natural persons, investment and IPR.
The relationship is elevated to a Special Strategic and Global Partnership.
India launches the Semicon India Programme with an outlay of Rs 76,000 crore, the pitch at the centre of this visit.
The 15th India-Japan Annual Summit in Tokyo produces the Joint Vision for the Next Decade and the JPY 10 trillion private investment target.
The Union Cabinet approves Semicon 2.0 with an outlay of Rs 1,27,500 crore.
Commerce and Industry Minister Piyush Goyal concludes his Japan visit after engagements in Tokyo, Nagoya and Osaka.
A chip passes through four broad stages. Design produces the circuit blueprint - capital-light, talent-heavy, and the stage where India already has a large share of global engineering work. Fabrication turns that design into circuits etched on a silicon wafer, in a fab costing billions of dollars and requiring ultra-pure water, uninterrupted power and cleanroom precision. Assembly, Testing, Marking and Packaging - ATMP, done by outsourced firms called OSAT providers - cuts the wafer into individual chips, encases them, tests them and marks them for shipment. Finally, equipment and materials suppliers feed all of the above with tools, wafers, gases and chemicals. ATMP/OSAT is where most countries enter the chain first: it needs a fraction of a fab's capital, employs far more people per rupee invested, and builds the supplier discipline a fab later depends on. That is why India's early approvals include packaging and test plants alongside its first fabs, and why the six-pillar framing lists design, machinery and materials, fabrication and ATMP/OSAT as separate pillars rather than folding them together.
Simple Analogy: Design is the architect's drawing, fabrication is casting the building's structure, and ATMP is the fitting-out, inspection and handover - unglamorous, but no one occupies the building without it.
Semiconductors, critical minerals and clean energy are the three areas where 'economic security' has displaced pure trade liberalisation as the organising idea of bilateral economic diplomacy - visible here in the resilient supply chain language.
The economic track runs alongside the Quad, the 2+2 Foreign and Defence Ministers' dialogue and the Act East Forum; CEPA (2011) and the Special Strategic and Global Partnership (2014) are the two dates to anchor.
The Semicon India Programme and the PLI schemes are the two big instruments of India's return to explicit sectoral industrial policy - useful for GS-3 questions on manufacturing and Make in India.
The release's emphasis on reliable power and ultra-pure water is a reminder that fabs are infrastructure projects as much as electronics projects - a standard link to renewable capacity, grid stability and industrial water use.
The roundtable on Foreign Institutional Investors and the engagement with Japanese life insurers and banks connects to India's efforts to attract long-term institutional capital as distinct from short-term portfolio flows.
GS Paper 2 > International Relations > Bilateral Groupings and Agreements; GS Paper 3 > Indian Economy > Industrial Policy
General Awareness > International Relations and Economy
General Awareness > Economy, Investment and International Institutions
General Awareness > Current Affairs
India-Japan economic ties and India's semiconductor programme are recurring Prelims and GS-2/GS-3 material, and semiconductors have appeared in every recent year's current affairs cycle.
Assembly, Testing, Marking and Packaging - the back-end stage of chipmaking; OSAT (Outsourced Semiconductor Assembly and Test) firms perform it as a service. One of the six pillars of India's strategy.
The top tier of India's bilateral partnership hierarchy with Japan, to which the relationship was elevated in September 2014.
Comprehensive Economic Partnership Agreement - a trade agreement covering goods, services, investment and movement of people; the India-Japan CEPA entered into force on 1 August 2011.
The Japan Business Federation, Japan's apex business lobby founded in August 1946, representing more than 1,500 leading companies.
The nodal agency under MeitY that administers the Semicon India Programme, launched in 2021 with an outlay of Rs 76,000 crore.