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ASML, the Dutch lithography company, announced at SEMICON India 2026 in New Delhi on 17 September 2026 that it has established a legal entity in India and is setting up a customer support office in the country.
It expects to begin with 20 to 30 young engineering graduates and scale with the pace of India's fab build-out.
ASML signed a partnership with Tata Electronics in May 2026 to support the set-up and ramp-up of the 300 mm semiconductor fab at Dholera, Gujarat.
The Dholera fab is an $11 billion project planned for 50,000 wafers a month, with operations due to start in 2028 for automotive, mobile and artificial intelligence customers.
ASML said India is aiming to meet 15 to 25 per cent of its own semiconductor demand locally by 2032.
Build a domestic semiconductor and display manufacturing ecosystem from scratch
Key: First phase approved in 2021 with an outlay of Rs 76,000 crore, run by the India Semiconductor Mission under MeitY
Widen support from fabrication units to materials, equipment, packaging and the wider supply chain
Key: Outlay of about Rs 1,27,500 crore across six pillars
A lithography machine projects a circuit pattern through a mask onto a light-sensitive layer coating a silicon wafer. Shorter wavelengths print finer features, which is why extreme ultraviolet light at 13.5 nanometres is used for the most advanced chips.
Simple Analogy: A stencil and a very fine spray, repeated layer upon layer on a wafer.
Runs India's semiconductor and display manufacturing schemes and organises SEMICON India; an independent business division under the Digital India Corporation
Global industry association for the electronics design and manufacturing supply chain; co-organises SEMICON India with the India Semiconductor Mission
GS Paper 3 > Science and Technology and Economy: indigenisation of technology, industrial policy and the semiconductor supply chain
General Awareness > Government schemes and economy: Semicon India and manufacturing locations
The capital-intensive plant where integrated circuits are built up layer by layer on silicon wafers; Dholera's is planned at 300 mm wafers.
Lithography using extreme ultraviolet light of about 13.5 nm wavelength, supplied only by ASML, needed for the most advanced chip nodes.
The MeitY body that administers India's semiconductor incentive schemes and approves fab and packaging projects.