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On 17 September 2026 at SEMICON India 2026 in New Delhi, US chip-equipment maker Applied Materials announced 'India Vision 2035': a US$5 billion investment in India over the next decade.
The plan has three pillars: deepen R&D in India, accelerate India's semiconductor ecosystem, and develop future talent.
It includes a 140-acre advanced semiconductor research park with cleanrooms in Bengaluru. It also plans to expand the India-based supply chain tenfold by 2035 and more than double R&D headcount.
The government said Semicon 2.0 has already drawn investment commitments of about ₹1 lakh crore (US$11-12 billion), expected to materialise over two to three years.
Second phase of India's chip programme, covering the whole value chain
Key: ₹1,27,500 crore; six pillars: design, machines and materials, fabs, advanced packaging, applied R&D, talent
First-phase incentives for fabs, display fabs, ATMP/OSAT units and chip design
Key: ₹76,000 crore; approved in December 2021; includes the Design Linked Incentive scheme for start-ups
Makes the machines used to deposit, etch and inspect material on wafers. It supplies chipmakers and does not make chips itself
Nodal agency for the Semicon India programmes; co-organises SEMICON India with SEMI
Parent ministry of ISM
A second US equipment major announced India's first silicon component facility in the same week. Equipment and materials suppliers are now joining the fab and packaging units
A greenfield semiconductor-materials plant. It fills the 'machines and materials' pillar of Semicon 2.0
5th edition, opened by PM Modi on the theme 'Silicon to Systems'. 12 chip projects have been approved and 3 are in commercial production
GS Paper III > Indian economy: industrial policy, investment; Science and Technology: electronics
General Awareness > Business and FDI news
The deposition, etching, lithography and inspection machines chipmakers buy. This is Applied Materials' business
A controlled space with very low airborne particles, needed to make and test chips
Post-fabrication steps that join and connect chips to raise performance; one of Semicon 2.0's six pillars